Post-Doc Position on Wafer-Scale Heterogeneous Integration of III-V Opto-Electronic Components by means of Transfer Printing
Ghent University – IMEC, Photonics Research Group
Closing date: Open until filled
Contact person: Prof. Gunther Roelkens (email@example.com)
We are looking for a highly motivated post-doc to take up a research position on the integration of III-V semiconductors on 200 mm silicon photonics wafers, based on a novel integration strategy that we are developing, called transfer printing. The processes will be developed in the imec R&D labs after which it will be transferred to a commercial foundry. The goal is to integrate III-V near-infrared light sources and photodetectors on silicon photonic integrated circuits for sensing applications. The work will be carried out in the context of a large European project (MicroPrince) where several industrial players are involved. The work can be extended to the integration of other opto-electronic devices in different wavelength ranges as well, serving different applications.
- The candidate should have a PhD in the field of photonics
- The candidate should have experience with III-V processing and/or heterogeneous integration technologies
- The candidate should have experience with the design and characterization of opto-electronic components