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Post-Doc Position on Wafer-Scale Heterogeneous Integration of III-V Opto-Electronic Components by means of Transfer Printing

Post-Doc Position on Wafer-Scale Heterogeneous Integration of III-V Opto-Electronic Components by means of Transfer Printing

Ghent University – IMEC, Photonics Research Group 
Closing date: Open until filled
Contact person: Prof. Gunther Roelkens ( This e-mail address is being protected from spambots. You need JavaScript enabled to view it )

Project Description

We are looking for a highly motivated post-doc to take up a research position on the integration of III-V semiconductors on 200 mm silicon photonics wafers, based on a novel integration strategy that we are developing, called transfer printing. The processes will be developed in the imec R&D labs after which it will be transferred to a commercial foundry. The goal is to integrate III-V near-infrared light sources and photodetectors on silicon photonic integrated circuits for sensing applications. The work will be carried out in the context of a large European project (MicroPrince) where several industrial players are involved. The work can be extended to the integration of other opto-electronic devices in different wavelength ranges as well, serving different applications.

EXPERIENCE:

 

  • The candidate should have a PhD in the field of photonics
  • The candidate should have experience with III-V processing and/or heterogeneous integration technologies
  • The candidate should have experience with the design and characterization of opto-electronic components

 

 

Application Link

http://photonics.intec.ugent.be/contact/vacancies/POST-DOC%20POSITION%20ON%20WAFER-SCALE%20HETEROGENEOUS%20INTEGRATION%20OF%20III-V%20OPTO-ELECTRONIC%20COMPONENTS%20BY%20MEANS%20OF%20TRANSFER%20PRINTING%20.pdf

 

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